Step 6:
​ESP machines sample parts in a first run. These parts are carefully inspected by our quality control team to ensure all aspects of the part meet the specifications. Samples are generally provided to the customer for qualification. 

ESP reverse engineering (re) of spare parts for varian, amat and tokyo electron semiconductor equipment companies
ESP reverse engineering process for TEL, Amat and SEMES in semiconductor industry for part performance improvement
ESP Reverse Engineering Process for amat, vat and SEMES semiconductor companies

​​​​Reverse engineering (RE) spare parts and consumables is one of ESP's core competencies. Every part is subjected to our thorough RE process to ensure every detail is captured. Our facility, equipment, and manufacturing expertise allow us to offer spare parts at a fraction of the cost without sacrificing quality or performance. ESP has saved our customers hundreds of thousands of dollars annually by supplying their spare parts.


Equipment & Materials Supported

Step 2:
​ESP captures all of the dimensions, tolerances, and surface profiles of the sample parts. We utilize different metrology equipment including CMMs, optical comparitors, and profilometers, to capture this information. 

Original Equipment Manufacturer (OEM)

Applied Materials (AMAT)EbaraMattson TechnologyTokyo Electron (TEL)
Dainippon Screen (DNS)Lam Research (LAM)Strausbaugh

Step 5:
(Optional) At the customer’s request, ESP can change almost any characteristic in the design to improve the part’s performance. These changes are easily implemented into the process, providing a quick and simple way for customers to test new designs.

ESP Reverse Engineering Process

ESP reverse engineering process for vat, Amat and TEL in semiconductor process equipment

Step 1:  
ESP begins with a detailed review of the project with the customer. We discuss the part’s critical features, mating parts, the operating environment, and so forth to gain a complete understanding of the project. We will collect a samples at this time.

Step 4:
​ESP creates all-inclusive CAD files from the information gathered. These files specify every aspect of the part including dimensions, tolerances, surface roughness, materials, coatings/platings, revision history and more. 

ESP reverse engineering process for Kokusai, Novellus and ASM in semiconductor processing equipments


Engineered PlasticsNon-Ferrous MetalsCeramics & Silicon Based Materials
Celazole (R) (PBI)Aluminum AlloysAlumina (Al2O3)
Delrin (R) (Acetal)Copper AlloysQuartz
Halar (R) (ECTFE)Hastelloys (R)Sapphire
Kel-F (R) (PCTFE)Inconels (R)Silicon Carbide (SiC)
Kynar (R) (PVDF)Nickel AlloysSilicon Nitride (Si3N4)
NylonStainless Steel AlloysYttrium Oxide (Yttria) (Y2O3)
PEEKTitanium AlloysZirconium Oxide (ZrO2)


Teflon (R) (PTFE) (PFA) (FEP)

Torlon (R) (PAI)

Vespel (R) (PI)

ESP reverse engineering process for KLA, TEL and Varian semiconductor equipment companies
ESP Spares LinkedIn page - Connect with us!

Step 3:
​A comprehensive material analysis is performed on the sample parts to determine the exact matrix material as well as any additives, or fillers, within the matrix. This step is critical as even a slight variation in the filler can drastically change the performance of the part. 

ESP reverse engineering process of semiconductor spare parts for Amat, ASM and vat semiconductor equipment manufacturers

​(512) 931-2701


ESP Spares, Inc.

300 Park Central Blvd. Ste. B

Georgetown, TX (USA) 78626

Phone: (512) 931-2701